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Originally Posted by Cricket
Keep an eye on the CPU temps if you can...a "double" layer of thermal interface material would actually act more like an insulator and reduce thermal transfer going on between the CPU and the heatsink.
 Cricket |
Very true. And the extra pad thickness may put additional strain on the bracket attached to the mobo. Those will commonly break in the area of the little square openings where the hsf tabs attach. Adding more thickness between the cpu and hsf could promote premature failure of that bracket.