1st POST went OK, how's my thermal paste?

[KQFan]

I followed a sticky about assembling the bare bones OUTSIDE of the case to do an initial POST. This was my 1st build and all went perfect!

So now I'm disassembling parts to start in on the case and I have an Intel Core 2 Duo E6300. When I took the heat sink/fan off the motherboard, the thermal paste (which was initially on the bottom of the heat sink in an X pattern) is now melted half on the chip and half on the heat sink.

Is this OK? IOW, I don't have to reapply, do I? I just want to do it right.

[Mr.Ferrari]

We'll you should've put the whole motherboard cpu heatsink assembly directly into the case after you pre assembled it outside.

But, no worries. You could just keep on with the current thermal paste, but it is preferred that you reapply thermalpaste once you disrupt it.

Just spread it out again to make sure there aren't any bubbles or gaps. Use a baggie over your finger.

[KQFan]

Thanks for the tip.