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Old 07-10-2007, 05:25 PM   #1
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thermal pad vs thermal compound

hey i was wonder about the pad and the compound. ive recently watched an amd video that suggested that the pad is for long term and compound short term. ive heard that the pad is evil and creates heat and should burn in hell anyways if anyone could clear this up itll be appreciated thx

ps is this powersuppley good? http://www.zipzoomfly.com/jsp/Produc...tCode=10005495
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Old 07-10-2007, 05:57 PM   #2
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Pads are fine for most purposes. Where you start gettings arguments is with the hard core overclockers.
The Cooler Master is an ok brand, don't think I'd use it on a hi-end gamer.
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Old 07-10-2007, 07:44 PM   #3
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well what would u consider a e6600 and 8800gts 320?
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Old 07-10-2007, 08:07 PM   #4
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I wouldn't use a Cooler Master PSU if you're using those parts in your build.

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Old 07-10-2007, 08:41 PM   #5
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I don't OC so all my builds for years now have been with the PIB (retail) version of the CPU w/ heatsink/fan combo. The pad is designed to work for years, as the PIBs come with a 3 year warranty. No company is going to risk their own product and warranty using a "evil" pad. I use to use OEM CPUs and grease until I realized I was giving up 2 years and 11 months of free warranty for me and my small clientèle.
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Old 07-10-2007, 09:06 PM   #6
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>.<
y it got to be so complex y cant there b a freakn big red sign that says here this is the crap you want get it and leave ><
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